The requirement as follows

Job title: Packaging Engineer

Duration: 12+ months

Location: REMOTE

Skills:

• Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.

• Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.

• Familiarity with image sensors and camera modules would be a plus

• 7-10 years’ of experience in hands-on Package/Module/PCB design

• BS/MS/equivalent experience in engineering; PhD preferred

Tools to know:

1. Cadence (APD/PCB Designer/OrCAD)

2. Mentor (Hyperlynx/Expidition)

3. HFSS

4. ANSYS

5. Sigrity