Overview

We’re seeking a highly experienced Principal Advanced Packaging Engineer to spearhead the development of cutting-edge semiconductor packaging technologies. This critical role focuses on chiplet integration, high-speed interconnect design, and 2.5D/3D IC packaging solutions for next-generation AI, HPC, and communication systems. You will collaborate across cross-functional teams, from concept to production, to push the boundaries of performance and reliability.

🔧 What You’ll Do

• Architect and develop advanced IC packaging solutions including flip-chip, TSV, chiplet, and 2.5D/3D stacking for AI and HPC systems.
• Lead substrate technology innovation using organic, silicon, and glass interposers, optimizing signal integrity, power delivery, and thermal performance.
• Partner with ASIC design, foundry, and OSAT teams for full-stack integration from BEOL to package-level.
• Implement and validate high-speed interconnect designs using tools like Cadence, ANSYS, and Siemens NX.
• Perform electrical, thermal, and mechanical simulations to ensure design reliability and manufacturability.
• Support reliability testing and failure analysis leveraging techniques such as SEM, TEM, FIB, AFM, and Raman spectroscopy.
• Apply FMEA, SPC, and DOE methodologies to refine packaging processes and deliver high-yield solutions.
• Mentor junior engineers and deliver technical training sessions focused on advanced packaging and heterogeneous integration.

✅ What You Bring

• Master’s degree in Materials Science, Electrical Engineering, or a related technical field.
• 10+ years of hands-on experience in semiconductor packaging, with a strong focus on chiplet and heterogeneous integration.
• Deep knowledge of substrate design, high-speed I/O, and BEOL/FEOL integration challenges.
• Proficiency with industry-standard tools: Siemens NX, Cadence Allegro/Virtuoso, ANSYS, JMP, and ThermoCalc.
• Expertise in failure analysis and metrology techniques (e.g., SEM, TEM, AFM, XPS).
• Solid grasp of AI/HPC-specific packaging needs and innovative solution paths.
• Proven ability to analyze failure modes, identify root causes, and drive corrective actions.