***No C2C or 3rd Party Candidates will be accepted

***Must currently reside in or near Sunnyvale, CA to be considered

Job Title: Hardware Design Engineer

Location: Sunnyvale-Remote

Responsibilities:

• Design of semiconductor packages and modules for AR/VR Silicon.

• Design feasibility studies based on electrical performance and form factor requirements.

• Support electrical extraction and SI/PI/PDN analysis on the package design.

• Ideation of new architecture/ design concepts such as novel interfaces for Sensor-Compute etc

Skills:

• Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.

• Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.

• Familiarity with image sensors and camera modules would be a plus

• 7-10 years’ of experience in hands-on Package/Module/PCB design

• BS/MS/equivalent experience in engineering; PhD preferred

Tools to know:

1. Cadence (APD/PCB Designer/OrCAD)

2. Mentor (Hyperlynx/Expidition)

3. HFSS

4. ANSYS

5. Signal Integrity

Education: Bachelors degree