Kuala Lumpur, Federal Territory of Kuala Lumpur, MY
16 days ago
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Summary
Responsibilities
Plan and execute projects to improve cost, yield, quality and productivity of products in his/her portfolio.
Analyze and resolve technical issues and challenges in Fab, Probe, Assembly, Test, and Design – working closely with global product, design, wafer fab process, device engineering and manufacturing teams.
Perform ATE test software programming, debugging and electrical failure analysis
Carry out test insertion reduction, parallel test conversion, test platform transfers, and development of innovative test methodologies.
Perform qualification of product changes, wafer fab transfers, and new package release.
Lead yield improvement, productivity and cycle time improvements.
Support of production lot disposition, determine root cause and fixes.
New product/process introduction, develop procedures and process controls for high volume manufacturing.
Develop production training materials and OCAPs.
Manage & support extended factory products testing/LOH disposition/CIP
Requirements
Master's/Bachelor's degree in Electronics or Electrical Engineering.
Proven skills in failure analysis, test software programming, statistical analysis (JMP/Minitab), and/or test methodology development (e.g. DFT) are highly desirable.
Knowledge of ATE Test a plus, especially for Advantest PS1600 and Teradyne UP1600/UFLEX+ Test systems.
Knowledge of Semiconductor Manufacturing is an added advantage.
Knowledge of UNIX, Perl, C/C++, and assembly language programming is an added advantage.
Good communication skills, self-motivated, result oriented and comfortable working either as an individual contributor or in a team
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