Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Senior Technical Program Manager will support the VP of FAE. The TPM manager must have hands-on experience in semiconductor packaging technologies, such as flip chip and wire bond technologies and their applications. Must be familiar with all phases of IC packaging processes and equipment. The TPM will coordinate with FAE team members and factory RnD, NPI, and Production teams to ensure successful execution of customers’ projects and programs. Requires excellent verbal and written communication skills. Good interpersonal skills are essential.

Responsibilities: Will include the following, other duties may be assigned:

1. Coordinate and manage all customer project related activities in the factory, including establishing and executing plans and key milestones for the customer projects and delivering the objectives on time.
2. Manage and resolve customer issues through closely collaborating with Tata Electronics’ factories, RnD, NPI, and sales teams.
3. Coordinate customer visits to the factory
4. Establish technical credibility, building trust and strong relationships with the customers to ensure quick problem solving above and beyond customer expectations.

Qualifications:

1. Bachelor’s degree in engineering or related fields.
2. Minimum of 10+ years of semiconductor manufacturing experience in assembly and test with in-depth understanding of the IC and/or module assembly and test process, including wire bond and flip chip technologies products.
3. Experience in working with customers and stakeholders of the program to resolve technical issues to support the business success of the program.
4. Strong verbal and written communication skills in English are essential along with interpersonal communications skills. Must be a team player with good organizational, computer and project management skills.
5. Be a quick learner, able to follow instructions and work independently