As an Integration Electrical Engineer at Reality Labs, you will help to create the next generation of SmartGlasses platforms. You would be expected to collaborate with internal design teams and external production partners. We are seeking experienced engineers that have demonstrated success navigating through the development and execution of end-to-end manufacturing processes in support of complex miniaturized systems such as opto-mechanical products, display, battery-operated, high speed interfaces, etc. Your proficiency in deciphering how design choices impact fabrication, assembly, and electrical performance is crucial for this role. You should be adept at recognizing the nuanced interplay between design decisions and their implications for manufacturability, yield, and overall product quality. The capacity to navigate trade-offs becomes essential, allowing them to push the envelope on design rules strategically, especially when pursuing miniaturization goals. This includes balancing the constraints imposed by design guidelines with innovative solutions to optimize manufacturing processes without compromising the integrity and reliability of the final product.5+ years of industry experience in electrical design Proven knowledge of electrical engineering fundamentals Experience with schematic and board design using Cadence OrCAD, Altium or equivalent Bachelor of Science in Electrical Engineering or related fields and/or equivalent experience. 5+ years of industry experience designing complex/miniaturized board designs (PCB/FPC/RFPC) and experience working closely with fabrication and assembly vendors to build respective designs. Experience with use of oscilloscopes, high speed digital test equipment, logic analyzers, or function generators Masters of Science in Electrical or equivalent engineering discipline. 7+ years of industry experience in electrical design Experience with high speed signaling over MIPI C-PHY/D-PHY, PCIe and/or USB port Experience with product-level failure mode investigation and analysis techniques (Dye and Pry, Cross section, Xray) as well as experience correlating given failure modes to specific process, material and design related stressors. Experience with JIRA common PCB CAD layout and DFM software (Cadence/Valor) and industry standards (IPC, JEDEC, IEEE, EIA, etc.). Experience with design for six sigma and, inclusive of structure problem solving approach, design experimentation and optimization (DOE), root cause and defect/failure analysis, FMEA, FEA, reliability testing, statistical data analysis, manufacturing process knowledge (MSA/GRR). Demonstrated experience in technical communication with cross-functional teams. Experience with audio, wireless, camera and power systems Experience with product KPI definition Experience leading technical teams, cross-functional groups and vendors against project plans