In this pivotal position within our organization, you will be responsible for driving the thermo-mechanical risk assessment of low-voltage electronics components and assemblies, shaping the future of electric vehicles. As a key player in the development of cutting-edge automotive electronics products, you will have the opportunity to influence the creation of vertically integrated devices through the strategic development and execution of comprehensive mechanical simulation models.
To excel in this role, you will require a deep understanding of mechanical engineering principles, simulation software, and design for reliability. You will be proficient in the use of advanced simulation tools and techniques to evaluate the thermo-mechanical performance of electronic components and assemblies. You will possess a strong understanding of the failure mechanisms associated with electronic components and assemblies, and be able to develop and implement strategies to mitigate these risks.
Your responsibilities will include:
-Leading the thermo-mechanical risk assessment of low-voltage electronics components and assemblies.
-Developing and executing comprehensive mechanical simulation models.
-Analyzing simulation results and identifying potential failure modes.
-Recommending design modifications to mitigate identified risks.
-Working closely with cross-functional teams to ensure the successful development and integration of electronic components and assemblies.
The ideal candidate for this position will have a proven track record of success in the automotive electronics industry. You will have a Master's degree or higher in Mechanical Engineering or a related field, along with a minimum of 5-8 years of experience in thermo-mechanical risk assessment of electronic components and assemblies.
- M.S. / Ph.D. in Mechanical Engineering or equivalent.
- 5 years (Ph.D) / 8 years (M.S.) of relevant industry experience working on problems in Structural Mechanics.
- Solid understanding of theoretical and experimental structural mechanics with good domain knowledge in the following areas: Non-Linear analysis, Explicit Analysis, Linear Dynamics and Vibrations, Couple Thermal-Structural analysis.
-Proficient with FEA solvers, preferably Abaqus and Optistruct.
-Proficient in pre/post processing tools such as Hypermesh, Ansa/Meta, etc.
-Excellent understanding of failure modes in metals, plastics, and elastomers.
-Proficient with using Python/Matlab for running analysis and post-analysis data processing.
-Good understanding of advanced material constitutive models for metals, plastics, foams, and elastomers.
-Good understanding of materials testing methods for metals, plastics, foams, and elastomers.
-Good understand of failure modes and reliability models for IC packages such as ASICs, Overmolded BGA packages, QFN packages, Discretes (Capacitors, Resistors, etc.).
- Experience with automotive ECU design and development is a plus.
- Experience with IC packaging manufacturing is a plus.
- Strong analytical and problem-solving skills.