Tesla's Dojo & Self-Driving Hardware team is looking for an IC Module Process Engineer who will be responsible for system module process for advanced IC package system including pathfinding, development and high volume manufacturing design for the next generation of Self-Driving Hardware and Dojo Super AI Computer. In this highly visible role, this engineer will contribute to Tesla's FSD and High Performance Computing projects by working closely with EE, SI/PI, thermal/mechanical, and package design teams. This engineer will also interface with material, substrate, memory, foundry and assembly house vendors. A successful candidate will have a strong growth mindset and be versatile in a highly dynamic environment * Work with cross-functional groups at Tesla and lead system module assembly process at Tesla * Explore and drive industry on advance system module asssembly technology development for new leading-edge products * Work with OSATs vendors to bring advanced system module assembly process solutions from concept to high volume manufacturing * Bachelor's Degree in a relevant field, or equivalent experience * 2+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability * Expert knowledge in System-In-Package assembly process technology development and qualification * Excellent engineering problem solving skills with strong physics and fundamentals * Excellent communication skills to work well with internal, cross functional teams and overseas suppliers * Optical module integration experience is a strong plus