该职位来源于猎聘 入职头3~6个月需要去深圳工作，之后工作地点为上海嘉定外冈！ Responsibilities

• Develops SMT assembly and soldering processes for new products and implement optimization solution for continuous process improvement with lean mindset 开发新产品的SMT组装和焊接工艺，并实施优化解决方案，以精益思维持续改进工艺
• Create and document processes, work instructions to guide manufacturing 创建并规范工艺流程、制作作业指导书用于指导生产
• Lead to programming, set up, debug and troubleshoot SMT manufacturing equipment and provide knowledge and skills where needed 主导所有 COB 制造设备的编程、设置、调试和故障排除，并在需要时提供知识和技术支持
• Develop PCBA reflow profiles to ensure solder joint reliability 开发 PCBA 回流曲线以确保焊点可靠性
• Define optimum processes parameters with DOE techniques 利用 DOE 方法定义最佳工艺参数
• Identify the root cause of yield/ quality issues and work with team in response to line QRQC 确定产量/质量问题的根本原因，并与团队合作响应生产线 QRQC
• Work with suppliers in designing, fabrication of SMT stencil, support plate, or other assembly fixtures 与供应商设计、制造SMT钢网、支撑底座或其他夹具
• Manipulate data files using Gerber, ODB++, DXF files 能处理 Gerber、ODB++、DXF 文件操作数据文件
• Knowledge and experience with DFM method to help facilitate manufacturability of PCBAs and Assemblies. Generate DFx reports to improve manufacturability of new products 具有DFM方面的知识和经验，有助于促进PCBA 和组件的可制造性。生成 DFx 报告以 提高新产品的可制造性 Qualifications & Requirements
• Bachelor, Engineering degree and knowledge of Product Group (product/process standards)
• Familiar with FMEA tool, CPK,GR&R, Quality tool such as QRQC, PDCA
• Personal skills to manage functional organization
• Valeo CIP development methodology or similar
• Financial skills about Product cost structure, pay back…
• Knowledge development knowledge (5/7 years)
• Get successful development experience as P0/P1 Project development (3/5 years)
• Highly appreciated experience in development functions, two year at least Others 其它 - 较强的合规意识 - 较强的责任心 - 能够自我激励，具有团队精神，能在压力下工作 公司介绍： 法雷奥集团总部在法国，是世界前十大汽车零部件供应商，全球汽车制造商合作伙伴。法雷奥汽车舒适及驾驶辅助系统中国事业部，由法雷奥集团100%投资，在深圳、广州和上海均有研发及生产制造基地，在高级辅助驾驶和智能座舱领域处于全球领先位置。法雷奥智能交通系统（上海）有限公司地址为上海嘉定外冈。公司目前在筹建阶段，公司是法雷奥集团的舒适驾驶系统事业部拟于2024年在中国区投建的新工厂，主要生产自动驾驶摄像头、域控制器，激光雷达等，预计2025年初正式投产。