Job Title: Senior Electrical Engineer - Advanced Semiconductor Packaging & Integration

Location: Santa Clara, CA (Onsite)

Duration: Long Term Contract | Full Time

Industry: Semiconductor | Micro-electronics | Advanced Packaging

Experience Level: Senior (10+ Years)

Company Overview:

Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.

Position Overview:

We are seeking a highly experienced Senior Product Lead with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.

Responsibilities:

• Lead the design and development of advanced semiconductor electronics and ASICs, ensuring high performance and reliability.

• Develop and optimize mixed-signal designs, balancing analog and digital circuit requirements.

• Oversee semiconductor processing and advanced packaging technologies to enhance device performance and manufacturability.

• Integrate High Bandwidth Memory (HBM) and Low Power Double Data Rate (LPDDR) memory into system designs for improved efficiency and speed.

• Implement chiplet integration techniques, focusing on high-speed chiplet I/O and interconnects.

• Ensure signal integrity and power integrity throughout the design and development process.

• Automate chip layout generation and format conversion to streamline design workflows.

• Design printed circuit boards (PCBs) with a focus on performance, reliability, and manufacturability.

• Conduct thermal simulations to optimize thermal management and ensure device reliability under various operating conditions.

• Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.

• Mentor and guide junior engineers, fostering a culture of continuous learning and innovation.

Requirements:

• M.S in Electrical Engineering, Computer Engineering, or a related field.

• Extensive experience in advanced semiconductor electronics and ASIC design.

• Proficiency in mixed-signal design and semiconductor processing techniques.

• Strong knowledge of advanced packaging technologies, including HBM and LPDDR integration.

• Experience with chiplet integration, high-speed chiplet I/O, and interconnects.

• Expertise in signal integrity, power integrity, and automated chip layout generation.

• Proven track record in PCB design and thermal simulations.

• Published works or patents in semiconductor technologies are highly desirable.

• Excellent leadership, communication, and project management skills.

• Ability to work collaboratively in a fast-paced and dynamic environment.

Preferred Qualifications:

• Ph.D. in a relevant field.

• Experience with leading industry-standard design and simulation tools.

• Published works or patents in semiconductor technologies.

• Excellent leadership, communication, and project management skills.

If you're interested, feel free to connect! 📩 Email: [email protected] | 📞 Phone: +1 816-445-8499