FAE (Field Application Engineer) to provide technical support and guidance for our General-Purpose GPU (GPGPU), and CPU chip design solutions. The role is primarily to support the integration of our chips into platform hardware, but some software support may also be required. The FAE will collaborate with customers and internal teams to ensure the successful integration and optimization of our products into various applications.

• Technical Support: Serves as the primary technical contact window for customers and partners, including both ODMs and OEMs, offering guidance on integrating our product into their systems.
• Pre-Sales Assistance: Deliver technical presentations, and product demonstrations, and help develop proof-of-concept solutions to showcase product capabilities.
• Post-Sales Support: Assist customers with application deployment, provide training on best practices, and troubleshoot hardware and software issues.
• Collaboration: Work with internal engineering to align product offerings with customer requirements and feedback.
• Documentation: Create technical documents, application notes, and user guides to facilitate customer understanding and product utilization.

• Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Science, or a related field.
• Experience:Minimum of 7 years in a technical support or application engineering role, preferably with experience in GPGPU or CPU technologies.
• Technical Proficiency: 
• Strong understanding of Server and PC architecture
• Familiarity with board-level interfaces: UART, I2C, SPI, JTAG, DDR, etc
• Knowledge of high-speed (PCIe & Ethernet), high-power, system design
• Board-level analog and digital circuit design expertise
• Test automation expertise using Python or similar tools
• HDL experience is a plus
• Communication Skills: Excellent verbal and written communication abilities, with a talent for conveying complex technical concepts to diverse audiences. Ability to understand complex customer technical issues, communicate them clearly to the internal engineering team, and work with the team to resolve them.
• Problem-Solving: Demonstrated analytical skills and a proactive approach to identifying and resolving technical challenges.
• Teamwork: Ability to work well in a team and be productive under aggressive schedules.
• Travel: Willingness to travel as needed to support customer engagements and training sessions.

• Experience in working with ODMs/OEMs to enable new silicon designs from NPI to mass production.
• Prior experience with CPU, GPU, and PCIe silicon and system applications.