This position offers a great opportunity to work on industry leading semiconductor devices, targeted for broad applications in Automotive and Industrial markets. In this role, you will be a member of a cross-functional team responsible for qualification and reliability solutions on AMG products (digital, analog, and mixed signal) during New Product Development (NPD) as well in multi-sourcing strategy.

As a member of the Quality and Reliability Team, you will be required to own, participate, lead, and drive below activities:
1. Primary responsibilities include owning all Product Qualification activities.
a. Design hardware for reliability testing (internal and/or externally with a vendor) across all products in ASG – Burn-in Boards, HAST boards, Temperature Humidity Bias Boards, and ESD boards.
b. Plan, track, and publish pre- and post- qualification test schedules & test results.
c. Own all failure disposition, driving root cause including EFA / PFA (electrical and physical failure analysis), and corrective actions documented and implemented where necessary
d. Interface with QRE and BU PE Teams on Qualification Plans, and providing Reliability Test Plans.
e. Drive cost reduction activities such as production burn-in reduction / elimination.
f. Interface with various cross-functional teams such as NPD PE, Program Management, QRE/CQE, Design, and Bench Development Engineers to define reliability stress test plan.
g. Document gaps, lessons learned, and best practices for better execution on future projects.

2. The candidate, in this role, is expected to learn and familiarize themselves with multiple Burn-in and Environment Stress Systems required for Qualification of semiconductor products.

Strong knowledge of semiconductor reliability and quality practices (e.g. JEDEC standards, AEC Q100 Specs). Good understanding of device physics and failure mechanism in analog/digital/mixed signal IC is a plus. Experience in failure analysis and isolation techniques such as FIB/SEM, TEM, LVI, Emmiscope, etc is an absolute requirement.

Strong data-analysis skills are a must, general coding and having programming skills, and ability to write scripts in C/C++ and PERL (or Python) is considered a plus.

Requirements:
• BSEE with minimum >7 yrs of direct experience running semiconductor IC qualifications
• Experience working with burn-in systems – designing burn-in HW & writing activation code on BI systems
• Experience in manufacturing metrics and problem solving in a manufacturing environment
• Excellent interpersonal skills – energetic, motivated, and self-driven
• Familiarity with various qualification industry specs (ex: AEC) and JEDEC specs for ESD, LU, THB, etc.
• Demonstrate ability to work well within a global team environment with minimal supervision
• Outstanding written and verbal communication skills
• Strong organizational skills; demonstrate ability to manage multiple tasks
• Strong knowledge of wafer-fab process, factory operations, assembly and test operations
• Ability to perform all activities in a safe environment, in support of all Health, Safety, & Security requirements