Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Job Responsibilities:

1. Reliability data test, analysis,and monitor.

2. New hotspot pattern and test methodology study for WAT(Wafer Acceptance Test) monitoring.

3. FAB process change management for reliability risk assessment management.

4. Circuit reliability and product reliability.

5. Customer service on reliability.

Job Qualifications:

1. Master's degree or Ph.D. in Electrical Engineering, Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline.

2. Hands-on participation and a strong sense of ownership are required.

3. Strong technical problem-solving and integral analytical skills based upon fundamental,rather than empirical models is required.

4. Excellent written and spoken communication skills. Bilingual in Mandarin and English.

5. Experience in IC fabrication is an added advantage.