@HYVE Solutions, missions to help customers, business partners, and employees achieve success through shared goals, strategies, resources and technology solutions. Hyve Solutions is a leader in the data center solutions industry, designing, manufacturing, and delivering custom Server, Storage, and Networking Solutions to the world's largest Cloud, Social Media, and Enterprise companies. We pride ourselves on collaboration, innovation and thought leadership. Our team consists of diverse, forward-thinking individuals who dare to challenge the status quo, while working with many of the world's biggest customers. Hyve Solutions is a part of Synnex Corporation, a Fortune 500 company. Become part of a team that thrives on excellence in a fast changing, high-growth technology environment! As part of Hyve's Technology Team, co-located in Portland OR, Taipei, and Fremont CA, you will join a small tightly-knit team that drives technology development and design execution that supports Hyve Solutions' CSP Datacenter Rack-Level Integration at Scale. Responsibilities: Provide platform & system mechanical/thermal architecture technical leadership for Hyve's server products at the server-level. Provide cross-functional leadership to define platform and system mechanical/thermal design specifications for Hyve's server platforms, by working with external CSP customers, external component suppliers (especially key chassis suppliers), hardware platform architects, hardware engineers, PD/SI/PI engineers, ME/Thermal engineers, firmware, product marketing teams, and especially by working with external customer-facing teams. Lead mechanical/thermal detailed design activities of platform and system in terms of components, sub-assemblies, and system integration at the server-level. Create and analyze thermal architecture specifications and implementation tradeoffs to meet cost and performance targets. Conduct mechanical/thermal design activities from concept to prototype to volume production. Work with platform team to develop, bring-up, and validate the designs to meet product requirements. * Prepare documentation and engineering release package for the mechanical/thermal designs. Secondary: This is a customer-facing role, and requires strong English communication skills, both written and verbal. Requires strong problem solving, documentation and organizational skills. Comfortable working in a very collaborative cross-Geo team working environment. Provide engineering support for CSP customers' questions related to mechanical/thermal design of server platform and system. Drive technology development activities to enable Hyve's next-gen server platforms. Hyve IP projects: supports customer inquiry feasibility for design concept before RFQ/RFP. @ HYVE Solutions, we believe employees are our greatest asset and we empower them to make a difference in our business. Diversity and inclusion make us all better. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.