MediaTek Incorporated is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. MediaTek is the number one Wi-Fi supplier across broadband, retail routers, consumer electronics devices and gaming, and its Wi-Fi 6 chipsets are powering the latest networking equipment for faster computing experiences.

Our dedication to innovation has positioned us as a driving market force in several key technology areas, highly including power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit https://yourcareers.mediatek.com/en for more information.

Summary:

We are looking for a highly experienced PISI Technical Leader to join our team. The ideal candidate will have extensive experience in Power Integrity and Signal Integrity, with a strong background in high-speed IO interface simulations and PDN analysis. As a PISI Technical Leader, you will guide customers through Signal Integrity and Power Integrity signoff, model and optimize system components, and collaborate with various teams to ensure optimal package, PCB, die, interposer, and substrate designs.

Job Description:

• Guide customers to complete Signal Integrity and Power Integrity signoff.
• Model and optimize vias, connectors, sockets, breakouts, and various system components using commercial tools.
• Perform system-level signal integrity simulation in high-speed IOs such as HBM, DDR, PCIe, SerDes, UCIe.
• Architect and simulate power delivery systems, including multiple dies, substrate, interposer, PCBs, and on-die PDN models.
• Collaborate with multiple teams, including layout, design, and customers, to optimize package, PCB, die, interposer, and substrate designs.

Requirements:

• 10+ years of Power/Signal Integrity related experience.
• Experience with high-speed IO interface simulations, including SerDes, PCIe, DDR, HBM.
• Experience with PDN analysis and simulation.

Salary range: $175,000- $255,000

Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.

MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.