We are looking for an experienced full-time PCB designer who can help us do PCB design planning and feasibility study, PCB/package co-design, component placement and routing, PCB design and methodology development.

Responsibilities

• PCB technology and material selection
• Stackup definition, power planning, high-speed signal route study with SIPI engineers
• Footprint and library build up
• Critical component ballmap optimization with package designers
• Feasibility study
• Component placement
• Power constraints
• HSIO constraint manager file generation
• Impedance calculation
• DFM/DFA
• PCB design methodology development
• PCB vendor interaction
  
  
  

Requirements

• Knowledge and experience of high power, high speed, high layer count PCB design
• Advanced PCB material and technology knowledge
• Expert with Cadence Allegro PCB and APD tool chain
• Willing to and proactively engage with system EE, SIPI, thermal/mechanical engineer, and package designers on early design exploration and solution path finding
• Basic SIPI knowledge
• Basic thermal/mechanical knowledge
• CPU/SOC/Microcontroller overall knowledge
• Excellent communication skills
• Great team player
• Highly motivated and self driven
  
  
  

Education And Experience

• Bachelor’s degree or technical training in PCB design
• CPU server, networking board design experience preferred
• Minimum 7 years related experience