Foxconn Interconnect Technology is seeking a Development Engineer at our Harrisburg, PA office.

Job Description:

• Design and engineer mold dies for various products in data interconnect and automotive industry including molded housings, insert molds, over-molds and two-shot molding is a plus.
• Be able to provide engineering support and feedback to product engineers about design for manufacturing when it comes to molding.
• Analyze parts and plastic materials in simulation software specifically mold flow and filling analysis.
• Be familiar with existing engineering plastic materials used in molding.
• Set up, operate, and troubleshoot existing mold equipment.

Education/Certification: BSME and experience in connector mold industry with journeymen toolmaker certifications.

Experience:

• Bachelor’s degree in mechanical / manufacturing engineering (molding) and 2+ years in molding die design.
• Or 5 years’ experience in mold die design and toolmaking.
• Experience with CAD is a must, SolidWorks or equivalent preferred.
• Experience with Mold flow software or equivalent preferred.
• Experience or familiarity in set up and operation of mold processing machines.

Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.

We offer our employees competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. At FIT, base pay is one part of our total compensation package. Individual pay is determined by several factors including but not limited to geography, job related knowledge, skills, experience, and relevant education and/or training. FIT is an equal opportunity employer Minorities/Females/Protected Veterans/Disabled.