The Dojo & Self-Driving Hardware teams at Tesla are looking for an Engineer to design IC Packages. This engineer will be part of the team to define and execute the design for the next generation of Self-Driving Hardware and Dojo Super AI Computer. This is a highly visible role where you will contribute to Tesla's FSD and High Performance Computing projects. You will work closely with IC package process, SI/PI, thermal/mechanical, and PCB layout teams. This engineer will also interface with material, substrate, assembly house and foundry vendors. A successful candidate will have a strong growth mindsets and be versatile in a highly dynamic environment. * Design: Set up layer stackup, design constraints (Physical, Space and Electrical), execute layout, optimize design based on design review and SI/PI simulation result * Feasibility Study: Review die floor plan, bump map, perform fan-out study and mockup design * Review/validation: Conduct DRC/DFM check based on design rules. Perform LVS check based on Verilog netlist and schematic * Engineering Degree in a relevant field, or equivalent experience * 2+ years hands on experience with flip chip IC package design * Proficient in Cadence APD+ and SiP Layout * Familiar with Unix, Python, TCL, MATLAB * Basic transmission line theory, signal and power integrity fundamentals