Mackenzie Stuart is partnered with a leading innovator in AI infrastructure seeking a Hardware Engineering Director to lead the design and productization of next-generation active optical cables, enabling scalable optical connectivity for AI and HPC systems. This critical role involves overseeing the end-to-end development process and managing a high-performance hardware team.

Key Responsibilities:

• Optical Cable Development: Lead the end-to-end development of high-speed 800G/1.6T optical pluggable cable systems using advanced microLED technology.
• System Architecture: Drive system architecture, board-level design, packaging, and optical-electrical co-design from concept through to pilot production for OSFP modules and CPO platforms.
• Team Management: Build and manage a cross-disciplinary hardware team specializing in signal integrity, opto-electronics, thermal, mechanical, and system validation.
• Prototype Testing: Own the bring-up and testing of evaluation boards, cable assemblies, and early prototypes in collaboration with silicon and optics teams.
• Validation Strategy Development: Define and implement validation strategies and manufacturing test plans to ensure readiness for high-volume production.
• External Collaboration: Partner closely with external stakeholders in silicon, packaging, and fiber optics to align on technical milestones.

Qualifications:

• Bachelor’s, Master’s, or PhD in Electrical Engineering, Optical Engineering, or a related field.
• 10+ years of experience in high-speed interconnects, optical modules, or cable development. Strong expertise in signal integrity, optical coupling, packaging integration, and system-level testing.
• Proven ability to lead and manage cross-disciplinary engineering teams and deliver complex hardware products.
• Hands-on experience with pluggable form factors, active optical cables, or optical engines.
• Excellent communication, leadership, and project management skills.

Preferred / Advantages:

• Experience with 100G/200G/800G optical link budgets and architectures.
• Familiarity with optical fiber coupling, VCSELs/microLEDs, photodiodes, and related packaging.
• Exposure to volume manufacturing, DVT, and compliance testing.
• Background in AI or HPC interconnect requirements is a plus.

Location:

• Candidate must be based in, or willing to relocate to, Ontario, Canada.

Due to the high volume of applications, if you have not heard back within 14 days, please assume your application has been unsuccessful.