Location : Remote

Pay rate is $70/hr on W2

Responsibilities:

Design of semiconductor packages and modules for AR/VR Silicon.

Design feasibility studies based on electrical performance and form factor requirements.

Support electrical extraction and SI/PI/PDN analysis on the package design.

Ideation of new architecture/ design concepts such as novel interfaces for Sensor-Compute etc

Skills: Skills:

Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.

Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.

Familiarity with image sensors and camera modules would be a plus

7-10 years' of experience in hands-on Package/Module/PCB design BS/MS/equivalent experience in engineering; PhD preferred

Tools to know:

Cadence (APD/PCB Designer/OrCAD)

Mentor (Hyperlynx/Expidition)

HFSS

ANSYS

Signal Integrity