Job Summary

We are seeking a skilled Failure Analysis Engineer with a strong background in PCBA to identify, analyse, and resolve product failures in both development and production stages. This role is crucial to improving product reliability, driving root cause investigations, and working cross-functionally to implement corrective actions.

Job Responsibilities

• Conduct thorough failure analysis on electronic assemblies and components (PCBA level) returned from production, customers, or validation.
• Utilize tools like X-ray, AOI, and cross-sectioning to identify root causes of solder joint failures, component issues, or board-level defects.
• Perform electrical testing and fault isolation using oscilloscopes, multimeters, and ICT/FCT systems.
• Analyze process-related issues such as solder bridging, tombstoning, cold joints, or voids in BGA and QFN packages.
• Document findings in detailed Failure Analysis Reports, including photos, data, and corrective action recommendations.
• Collaborate with design, test, and manufacturing engineering teams to improve DFM/DFT and overall reliability.
• Support CAPA (Corrective and Preventive Action) and continuous improvement initiatives.
• Maintain failure database and trend analysis for recurring issues.
  
  

Job Requirements

• Bachelor’s degree in Electronics, Electrical, Materials, or Mechanical Engineering.
• 2–5+ years of experience in failure analysis or reliability engineering, preferably in a PCBA or EMS environment.
• Proficient in tools: X-ray inspection, SEM/EDS, AOI, ICT, thermal analysis, microscopes.
• Understanding of SMT, wave soldering, reflow processes, ICT, and FTs.
• Experience with IPC standards (e.g., IPC-A-610, IPC-7711/7721) is a plus.
• Strong analytical, documentation, and communication skills.
• Experience with FA software, report automation tools, or statistical tools like Minitab.
• Familiarity with Six Sigma, 8D, 5 Whys, or FMEA methodology.
• Knowledge of RoHS/REACH compliance, ESD standards, and component de-rating.