Be responsible for the failure analysis of digital related failure, including but not limited to electrical failure analysis (EFA) and physical failure analysis (PFA).
制定数字芯片失效分析方案,运用各种FA工具和技术对失效样品进行分析。
Develop digital related function failure analysis plans, use various advanced analysis tools and techniques to analyze failed samples.
与设计,工艺,测试部门紧密合作。协同解决芯片在研发、生产和应用过程中的失效问题,找到根本原因。
Work closely with design, technology development and test department collaboratively to solve the failure problems that occur during the R & D, production, and application. Dig out the root cause.
撰写失效分析报告,清晰阐述失效原因、分析过程和结论,为产品质量提升和研发改进提供有力支持。
Write detailed failure analysis reports, clearly stating the failure cause, analysis process, and conclusion, providing strong support for product quality improvement and R & D improvement.
任职要求/Job Requirement:
电子工程、微电子等相关专业硕士及以上学历,具有 3年以上数字芯片失效分析工作经验。
Master's degree or above with related major of electronic engineering, microelectronics. With at least 3 years of working experience in digital IC failure analysis.
对于常见的数字IC失效,比如scan chain, SRAM, FLASH and MCU等产品具有相关的失效分析工作经验。
Experience with common digital function related failure analysis case, such as scan chain, SRAM, FLASH and MCU failure case and register read/write failure case.