Package Design Engineer is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:

1. Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
2. Generate test vehicle design and the related PCB design.
3. Prepare design risk assessment report.
4. Generate reticle and stencil design.
5. Generate other schematics or drawing as requested.

• Review, maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Support audits
• Any other ad-hoc duties as assigned

Requirement

• Minimum Master’s Degree in electrical engineering or similar discipline
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
• Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will be an advantage
• Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors
• Experience with PCB test board design
• Fresh graduates are welcome to apply