Piper Companies is looking for a CoWoS Principle Packaging Engineer who will construct and enhance Chip-on-Wafer-on-Substrate packaging technology to support high-performance AI and data center applications onsite in Saratoga, CA. The ideal CoWoS Principle Packaging Engineer will collaborate with cross-functional teams to facilitate smooth integration of advanced multi-die packages. Responsibilities for the CoWoS Principle Packaging Engineer: * Lead the advancement of CoWoS packaging technology to enhance chip performance, power, and reliability. * Develop and enhance CoWoS packaging processes to ensure superior thermal, mechanical, and electrical performance. * Work closely with cross-functional design, test, and manufacturing teams for seamless chip-package integration. * Implement strategies to enhance yield and address failure modes across packaging flows. Qualifications for the CoWoS Principle Packaging Engineer: * 15+ years' experience in advanced semiconductor packaging and interconnect processes. * Demonstrated expertise in CoWoS / FOCoS, or FOWLP and proficient in EMIB, InFO, and advanced 2.5D/3D integration technologies. * Deep knowledge of thermal management, reliability testing, and signal/power integrity challenges. * Proven experience working with TSMC and leading OSATs. * Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance. * Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field. Compensation/Benefits for CoWoS Principle Packaging Engineer: * Salary/rate range: $210,000 - $290,000 annually * Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave if required by law, and Holidays. This job opens for applications on 5/2/2025. Applications for this job will be accepted for at least 30 days from the posting date. Keywords: Semiconductor Packaging, CoWoS, FOCoS, FOWLP, EMIB, InFO, 2.5D/3D Integration, AI Infrastructure, Data Center Applications, Thermal Management, Reliability Testing, Signal Integrity, Power Integrity, TSMC, OSAT #LI-BR1 #LI-ONSITE #PANDO