Wire bond BGA development and introduction. 2. New technology development include material and process for memory. 3. Package technology integration and project management. 4. Survey and estimate OSAT technology capability. 5. Process standard definition, package standard definition. 6. Co-work with chip design and system verifiction team.
任职资格
Have wire bond BGA package experience more than 8years. 2.Proficient in package assembly process, machine and material 3.Famillar with grinding and dicing，or die bond or wire bond process 4.Well know substrate,moding compound and other package material etc. 5.Well know package design rule or package on package development experience is better. 6.Data analysis well (Like 6sigma tool, JMP etc.) 7.Have good communication and teamwork skills 8.Famililar with SI/PI is better
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