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Back End Engineer
Mayo-Kebbi Est, TD
ChangXin Memory Technologies, Inc.
数字后端工程师 I Digital Backend Design Engineer(J13616)
Mayo-Kebbi Est, TD
29 days ago
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Summary
工作职责
SOC 芯片的顶层集成与布局规划，从Netlist 到GDS，包括Chip/block level Floorplan, 时序分析，时钟数综合，IR drop分析等自动布局布线设计； 2. 建立和优化RTL2GDS flow, 精通RTL2GDS flow的各种 INPUT File。（如netlist, sdc, LEF, LIB, tech file etc., 负责数字后端设计流程的维护和完善； 3. 精通STA静态时序分析，负责芯片timing signoff； 4. 精通静态及动态功耗分析，熟练使用PTPX以及Redhawk等功耗分析工具进行功耗分析及signoff； 5. 主导开发和改进后端实现流程和规范； 6. 从后端实现角度为芯片架构定义和设计提供支撑和改进建议；
任职资格
熟悉主流的APR工具（ICC2，Innovus等），精通后端实现各种工具和流程，如floorplan，place，Power规划，CTS，时序分析，布局布线等； 2. 熟练的脚本技能（如tcl，perl，python）； 3. 具备扎实的时序收敛与signoff 的技能； 4. 10年以上后端APR经验，独立负责过两款以上量产芯片的顶层物理设计和验证工作，具有丰富的后端流程经验； 5. 具有很强的项目计划，执行和总结能力； 6. DDR/LPDDR PHY相关后端设计经验者优先。
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